Domestic big factory has been able to package 4nm mobile PHONE CPU

Domestic big factory has been able to package 4nm mobile PHONE CPUThere is news tonight, the official announcement of China's JCC technology, said it can achieve the packaging of 4nm mobile phone chips, and in addition to mobile phone chips, PC CPU, graphics card GPU chips can also achieve packaging.

Compared with the traditional chip stacking technology, the advantage of multidimensional heterogeneous packaging is that it can achieve higher density chip packaging by introducing the intermediary layer and its multidimensional combination.

Leave a Comment

Shopping Cart